PCBA: Printed Circuit Board Assembly

Facilities

  • Over 75,000 sq/ft of “State of the Art” manufacturing space
  • 3 high-speed SMT [Surface Mount Technology] lines for maximum flexibility
    • Consisting of:
      • Siemens(ASM)
      • Fuji
      • Universal
      • Panasonic
      • Heller 13 Zone Oven
      • Solder Paste Inspection
      • AOI [Automated Optical Inspection]

Manufacturing Capabilities

  • IPC-A-610 Workmanship Standard, Class 2 & 3
  • J-STD-001 – including Space Addendum (/S)
  • IPC-620
  • AS9100C
  • ISO 13485
  • Lot Traceability & Control
  • In-line solder paste inspection
  • RoHS [Reduction Of Hazardous Substances] and Leaded Processes
  • Conflict minerals expertise
  • Aqueous clean and no-clean
  • Conformal coat
  • Discrete Packages to 0201
  • Micro BGA [Ball Grid Array]
  • Higher Level Assembly (Box Build and System Level)
  • Chip Scale Packages
  • POP [Package on Package]
  • Selective Solder
  • Agilent 5DX Laminography