Facilities
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Over 75,000 sq/ft of “State of the Art” manufacturing space
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3 high-speed SMT [Surface Mount Technology] lines for maximum flexibility
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Consisting of:
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Siemens(ASM)
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Fuji
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Universal
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Panasonic
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Heller 13 Zone Oven
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Solder Paste Inspection
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AOI [Automated Optical Inspection]
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Manufacturing Capabilities
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IPC-A-610 Workmanship Standard, Class 2 & 3
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J-STD-001 – including Space Addendum (/S)
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IPC-620
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AS9100C
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ISO 13485
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Lot Traceability & Control
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In-line solder paste inspection
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RoHS [Reduction Of Hazardous Substances] and Leaded Processes
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Conflict minerals expertise
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Aqueous clean and no-clean
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Conformal coat
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Discrete Packages to 0201
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Micro BGA [Ball Grid Array]
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Higher Level Assembly (Box Build and System Level)
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Chip Scale Packages
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POP [Package on Package]
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Selective Solder
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Agilent 5DX Laminography
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